Scintacor produces an affordable alternative to FOP-based CsI scintillators, with a thin non-glass substrate replacing the Fibre Optic Faceplate.
With FOP-based scintillators (diagram below), the x-rays strike from the ‘tips’ side of the CsI layer and the emitted light is extracted from the opposite ‘base’ side of the layer, passing through the x-ray blocking FOP into the sensor chip.
BrightForm CsI extracts light in the same orientation, but allows the FOP (if required) to be applied to the sensor independently, making visual inspection of the bond possible. The BrightForm CsI scintillator can be press fitted to the x-ray blocking FOP (diagram below) or directly onto the sensor.
Simplified Assembly
Alternatively, the FOP can be left out to reduce cost and weight (diagram below), but with no x-ray blocking layer between the CsI and the sensor, incoming x-rays pass into the sensor much more readily.
The two graphs below show the typical CsI thickness dependence of the brightness and resolution for BrightForm CsI versus a typical FOP-based scintillator.
Our technologies are used in a wide variety of applications across x-ray, UV, EUV, IR, electron and neutron, detection and imaging. Trust our phosphor and scintillator expertise to optimise performance for your specific application.
From simple to complex shapes, with edge-to-edge coating, and custom sizing to maximise the active area of any sensor.
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info@scintacor.com
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